Packaging Technology for Sensor and Actuator MEMS Devices

Rf & Microprocessor Circuits for Mems Sensor Packaging

In the resent years wireless Home Automation products like lightning, thermostats blinds/drapes and appliance control, energy management, access control and building automation has reached the market. With the combination of highly integrated RF and micro-processor platform and micro electromechanical systems (MEMS) the wireless sensors and actuators of tomorrow will be ultra cheap and small an...

BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed...

Self-Assembly Techniques for Massively Parallel Packaging of MEMS Devices

Self-Assembly Techniques for Massively Parallel Packaging of MEMS Devices Jiandong Fang Chair of Supervisory Committee: Professor Karl F. Böhringer Electrical Engineering This dissertation investigates applications of self-assembly for massively parallel packaging of flat micro-components, the most common appearance of microelectromechanical systems (MEMS) or CMOS chips. Self-assembly assembles...

CVD diamond thin film technology for MEMS packaging

Due to its extreme hardness, chemical and mechanical stability, large band gap and highest thermal conductivity, poly-crystalline diamond (poly-C) is expected to be an excellent packaging material for biomedical and environmental MEMS devices. A poly-C thin film packaging technology has been developed to explore the application of this novel material on post-MEMS encapsulation packaging process...

Characterization of PLZT Ceramics for Optical Sensor and Actuator Devices